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22.
Fabrication of High Performance Bio-Composite based Bacterial Cellulose with Conducting Polymer
Yeong-Min Yoo Hyun-Joong Kim Sera Jeon Ji-Won Park
Seoul, South Korea
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21.
EVA/Intumescent Agent Flame Retardant Composite
Hoon Kim Ji-Won Park Jung-Hun Lee Hyun-Joong Kim
Seoul, South Korea
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20.
Predication and Calculation of Properties of the Bio-Composite
Jong-Gyu Lee Hyuk-Jin Kwon Ji-Won Park Hyun-Joong Kim
Seoul, South Korea
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19.
Bio-Composite of Kenaf Fibers in PLA for Automotive Interior Parts
Tae-Hyung Lee Ji-Won Park Byung-Ho Lee Hyun-Joong Kim
Seoul, South Korea
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18.
Research Trend of Bio-Composite
Hyun-Joong Kim
Seoul, South Korea
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17.
Electrical Conductive and Opitical Transparancy of Bacterial Cellulose Based Composite in Different Cultivation Methods
Yeong-Min Yoo Sera Jeon Ji-Won Park Hyun-Joong Kim
Nanjing, China
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16.
Fabrication and Evaluation of Composite based Bacterial Cellulose with Ionic Conducting Polymer
Yeong-Min Yoo Sera Jeon Ji-Won Park Hyun-Joong Kim
Nanjing, China
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15.
Fabrication and Characterization of Bacterial Cellulose based Nanocomposite and Its Applications
Hyun-Joong Kim Hyeok-Jin Gwon Sera Jeon
Hanyang University, South Korea
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14.
Silane Treatment of Biocomposite to Improve Interfacial Adhesion and Thermal Stability
Sera Jeon Ji-Won Park Hyun-Joong Kim
Hanyang University, South Korea
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13.
Evaluation and Prediction of Property of Bio/Nano-Composites
Ji-Won Park Sera Jeon Jeong-Hun Lee Hyeok-Jin Gwon Hyun-Joong Kim
Hanyang University, South Korea
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12.
Adhesion Performance and Curing Behaviors of Dual Curable Urethane Acrylic Adhesives for Temporary Bonding in 3D Multi-chip Package Process
Seung-Woo Lee Cho-Hee Park Ji-Won Park Dong-Hyuk Lim
Beijing, China
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11.
Evaluation of UV Curing Behavior of UV Curable Resin through a Variety of Devices
Ji-Won Park Jong-Gyu Lee Seung-Woo Lee Cho-Hee Park Hyun-Joong Kim Jin Ku Cho Seung-Han Shin
Beijing, China
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10.
Curing Behavior and Thermal Property of Adhesive Based on Epoxy and Acrylic Functionalities
Cho-Hee Park Seung-Woo Lee Ji-Won Park Hyun-Joong Kim
Beijing, China
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9.
Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
Seung-Woo Lee Cho-Hee Park Ji-Won Park Hyun-Joong Kim Dong-Hyuk Lim Jun-Yeob Song Jae-Hak Lee Hyoung-Jun Kim
Kitami Institute of Technology, Japan
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8.
Improvement of Thermal Stability of Photo-cured Pressure Sensitive Adhesive by Multi-functional Crosslinker and Filler
Hyung-Il Kim Myeongrang Kang Chong-Min Ryu Jin-Xin Hyun-Joong Kim
Kitami Institute of Technology, Japan
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7.
Adhesive Modification for Temporary Wafer Bonding
Cho-Hee Park Seung-Woo Lee Ji-Won Park Hyun-Joong Kim Dong-Hyuk Lim Jun-Yeob Song Jae-Hak Lee
Kitami Institute of Technology, Japan
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6.
UV-curing Behavior and Thermal Property of Temporary Adhesives in MCP Process
Seung-Woo Lee Cho-Hee Park Ji-Won Park Hyun-Joong Kim Dong-Hyuk Lim Jun-Yeob Song Jae-Hak Lee Hyoung-Jun Kim
Kitami Institute of Technology, Japan
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5.
Electrical and Optical Properties of Nanocellulose and Its Applications
Hyun-Joong Kim
Hawaii, United States of America
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4.
The Evaluation on UV Cring Behavior of UV curable Materials
Ji-Won Park Seung-Woo Lee Cho-Hee Park Hyun-Joong Kim Jin-Ku Cho Seung-Han Shin
Meiji University, Japan
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3.
UV-curing and Thermal Properties of Dual Curable Urethane Epoxy Adhesives for Temporary Bonding in 3D Multi-Chip Package Process
Seung-Woo Lee Cho-Hee Park Ji-Won Park Hyun-Joong Kim Jun-Yeob Song Jae-Hak Lee
Meiji University, Japan