접착과학 및 바이오복합재료 연구실

Publication International Conference

International Conference

The 51st Symposium on Adhesion - THE ADHESION SOCIETY OF JAPAN
  • June 20, 2013 ~ June 21, 2013
  • Meiji University, Japan
  • The 51st Symposium on Adhesion - THE ADHESION SOCIETY OF JAPAN

Total Results : 3

  • 3. The Evaluation on UV Cring Behavior of UV curable Materials
    Ji-Won Park Seung-Woo Lee Cho-Hee Park Hyun-Joong Kim Jin-Ku Cho Seung-Han Shin
    The 51st Symposium on Adhesion - THE ADHESION SOCIETY OF JAPAN (June 20, 2013 ~ June 21, 2013 / The 51st Symposium on Adhesion - THE ADHESION SOCIETY OF JAPAN)
    Meiji University, Japan
  • 2. UV-curing and Thermal Properties of Dual Curable Urethane Epoxy Adhesives for Temporary Bonding in 3D Multi-Chip Package Process
    Seung-Woo Lee Cho-Hee Park Ji-Won Park Hyun-Joong Kim Jun-Yeob Song Jae-Hak Lee
    The 51st Symposium on Adhesion - THE ADHESION SOCIETY OF JAPAN (June 20, 2013 ~ June 21, 2013 / The 51st Symposium on Adhesion - THE ADHESION SOCIETY OF JAPAN)
    Meiji University, Japan
  • 1. Modification and Characterization of Polyurethane for Temporary Wafer Bonding
    Cho-Hee Park Seung-Woo Lee Ji-Won Park Hyun-Joong Kim Jun-Yeob Song Jae-Hak Lee
    The 51st Symposium on Adhesion - THE ADHESION SOCIETY OF JAPAN (June 20, 2013 ~ June 21, 2013 / The 51st Symposium on Adhesion - THE ADHESION SOCIETY OF JAPAN)
    Meiji University, Japan