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2013 Beijing International Bonding Technology Symposium and 5th Asian Conference on Adhesion
September 15, 2013 ~ September 17, 2013
Beijing, China
2013 Beijing International Bonding Technology Symposium and 5th Asian Conference on Adhesion
Total Results : 3
3.
Oral
Adhesion Performance and Curing Behaviors of Dual Curable Urethane Acrylic Adhesives for Temporary Bonding in 3D Multi-chip Package Process
Seung-Woo Lee
Cho-Hee Park
Ji-Won Park
Dong-Hyuk Lim
2013 Beijing International Bonding Technology Symposium and 5th Asian Conference on Adhesion
(September 15,
2013
~ September 17,
2013
/ 2013 Beijing International Bonding Technology Symposium and 5th Asian Conference on Adhesion)
Beijing, China
2.
Oral
Evaluation of UV Curing Behavior of UV Curable Resin through a Variety of Devices
Ji-Won Park
Jong-Gyu Lee
Seung-Woo Lee
Cho-Hee Park
Hyun-Joong Kim
Jin Ku Cho
Seung-Han Shin
2013 Beijing International Bonding Technology Symposium and 5th Asian Conference on Adhesion
(September 15,
2013
~ September 17,
2013
/ 2013 Beijing International Bonding Technology Symposium and 5th Asian Conference on Adhesion)
Beijing, China
1.
Oral
Curing Behavior and Thermal Property of Adhesive Based on Epoxy and Acrylic Functionalities
Cho-Hee Park
Seung-Woo Lee
Ji-Won Park
Hyun-Joong Kim
2013 Beijing International Bonding Technology Symposium and 5th Asian Conference on Adhesion
(September 15,
2013
~ September 17,
2013
/ 2013 Beijing International Bonding Technology Symposium and 5th Asian Conference on Adhesion)
Beijing, China
1