접착과학 및 바이오복합재료 연구실

Total Results : 22

• 2. OralModification and Characterization of Polyurethane for Temporary Wafer Bonding
  Cho-Hee Park Seung-Woo Lee Ji-Won Park Hyun-Joong Kim Jun-Yeob Song Jae-Hak Lee
  The 51st Symposium on Adhesion - THE ADHESION SOCIETY OF JAPAN (June 20, 2013 ~ June 21, 2013 / The 51st Symposium on Adhesion - THE ADHESION SOCIETY OF JAPAN)
  Meiji University, Japan
• 1. OralUV-curing Behaviors and Themal Properties of Dual Curable Urethane Epoxy Adhesives For Tempopary Bonding in 3D Multi-Chip Package Process
  Seung-Woo Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim
  The 2013 Annual Meeting of the Adhesion Society (March 03, 2013 ~ March 06, 2013 / The 2013 Annual Meeting of the Adhesion Society)
  Florida, United States of America