-
311.
Hybrid Curable OCA for New Assembly Line of Touch Screen Panel
Hyun-Joong Kim
Savannah, United States of America
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310.
Synthesis and Evaluation of Hybrid Curing OCA Using UV Polymerization
Hyun-Joong Kim Tae-Hyung Lee Sung-Ju Lee Ji-Won Park
Savannah, United States of America
-
309.
Evaluation of UV-Curing Kinetics of the UV Polymerized Adhesives with Poly(ethylene glycol) Dimethacrylate
Ji-Won Park Hoon Kim Hyun-Joong Kim
Savannah, United States of America
-
308.
Understanding and Evaluation on the Linear Shrinkage of Photo-Curing Behavior through the Experimental Approach and Numerical Modeling
Ji-Won Park Jong-Gyu Lee Hyun-Joong Kim
Savannah, United States of America
-
307.
The Role of the Adhesive to Overcome the Bottleneck in the Electrical and Electronic Convergence Industry [Invited Speaker]
Hyun-Joong Kim
Shanghai, China
-
306.
EVA/Intumescent Agent Flame Retardant Composite Materials using Organic/Inorganic Hybrid Filler
Ji-Won Park Hoon Kim Hyun-Joong Kim
Johannesburg, South Africa
-
305.
Challenge of New OCA for the Next Generation Display [Invited Speaker]
Hyun-Joong Kim
Kobe International Conference Center, Japan
-
304.
Polymer Syntheis and Properties of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
Seung-Woo Lee Tae-Hyung-Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim Seung-Man Kim Jae-Hak Lee Jun-Yeob Song
University of Tokyo, Japan
-
303.
Polymer Testing of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
Seung-Woo Lee Tae-Hyung Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim Sung-Hun Lee Seung-Man Kim Jae-Hak Lee
University of Tokyo, Japan
-
302.
Design and Characterizations of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
Seung-Woo Lee Tae-Hyung Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim Sung-Hun Lee Seung-Man Kim Jae-Hak Lee
University of Tokyo, Japan
-
301.
Application and Development of Nano-Cellulose based Nano-Bio-Composites
Hyun-Joong Kim
Kauffman Foundation Conference Center, United States of America
-
300.
Research Trend of Nano-Composie & Bio-Composites [Invited Speaker]
Hyun-Joong Kim
Yamaguchi University, Japan
-
299.
Non-Halogen System of Flame
Ji-Won Park
Yamaguchi University, Japan
-
298.
New Biocomposites for Bioscrew in Bone Joint Desease
Tae-Hyung Lee Ji-Won Park Hyun-Joong Kim
Yamaguchi University, Japan
-
297.
Design and Characterization of Temporary Bonding and Debonding Adhesives for 3D Multichip Packaging Process
Seung-Woo Lee Tae-Hyung Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim
Nara Prefectural New Public Hall, Japan
-
296.
Preparation of Cloud Point Resistant-adhesive and its Performance for Touch Screen Panel
Hyun-Joong Kim Cho-Hee Park
Nara Prefectural New Public Hall, Japan
-
295.
Synthesis and adhesion performance of acrylic polymer/organoclay nanocomposite PSAs by in-situ photoinitiated polymerization
Hoon Kim Ji-Won Park Cho-Hee Park Hyun-Joong Kim Seung-Han Shin
Nara Prefectural New Public Hall, Japan
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294.
Thermal Properties of Acrylic Pressure Sensitive Adhesives with Micro-encapsulated Phase Change Material(PCM) and Single Wall Carbon Nanotubes(SWCNT)
Seong-Ju Lee Ji-Won Park Seung-Woo Lee Hyun-Joong Kim Seung-Han Shin
Nara Prefectural New Public Hall, Japan
-
293.
The role of the adhesive to overcome the bottleneck in the electrical and electronic convergence industry [Invited Speaker]
Hyun-Joong Kim
Nara Prefectural New Public Hall, Japan
-
292.
Research on Conductivity Change of Electrical Conductive Adhesives depends on Shrinkage
Jong-Gyu Lee Ji-Won Park Peng Dou Hyun-Joong Kim Seung-Han Shin
Nara Prefectural New Public Hall, Japan