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16.
Development of Pressure Sensitive Adhesives for Diffcult-to-bond Materials
Seong-Ju Lee Dong-Hyuk Lim Ji-Won Park Hyun-Joong Kim
Aichi Institute of Technology, Japan
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15.
Preparation and Characterization of Dual Curable Adhesives for Display Bonding Process
Jong-Gyu Lee Gyu-Seong Shim Ji-Won Park Hyun-Joong Kim Sang-Eun Moon Young-Kwan Kim Dong-Hun No
Aichi Institute of Technology, Japan
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14.
Aging Behavior Characterization of Optical Bonding Material for Touch Screen Panel
Cho-Hee Park Seong-Ju Lee Tae-Hyung Lee Hyun-Joong Kim
Aichi Institute of Technology, Japan
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13.
Development of New Type of Optical Pressure-Sensitive Adhesive of Utilizing the Complex Curing System
Ji-Won Park Tae-Hyung Lee Jong-Gyu Lee Hyun-Joong Kim
Aichi Institute of Technology, Japan
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12.
Improved Strength of the PLA utilizing Nano-Cellulose
Tae-Hyung Lee Cho-Hee Park Hoon Kim Hyun-Joong Kim
National University of Singapore, Singapore
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11.
Composite Development of PLA/CCS based Polymer
Ji-Won Park Seong-Ju Lee Gyu-Sung Shim Hyun-Joong Kim
National University of Singapore, Singapore
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10.
Manufacture and Evaluation of PLA based Bio-Screw
Jung-Hun Lee Pan-Seok Kim Jong-Gyu Lee Hyun-Joong Kim
National University of Singapore, Singapore
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9.
Analysis of the Re-stacking Structure of Clay Dispersioned Intumescent Flame Retardant Composites
Jung-Hun Lee Hoon Kim Ji-Won Park Hyun-Joong Kim Jung-Youn Choi
Tunisia, Tunisia
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8.
Flame Retardant Nanocomposite Materials Utilizing Intumescent System and Nano Clay
Hyun-Joong Kim Ji-Won Park Hoon Kim Jung-Hun Lee M-J Kwon J-Y Choi
Tunisia, Tunisia
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7.
Manufacturing Polylactic Acid (PLA)/Nano Crystal Cellulose(NCC) by Solution Blending and Investigation of Improved Mechanical Properties
Tae-Hyung Lee Sung-Ju Lee Ji-Won Park Hyun-Joong Kim
Tunisia, Tunisia
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6.
Temporary Bonding and UV Laser Debondable Adhesives for 3D Multi-chip Packaging Process [Invited Speaker]
Hyun-Joong Kim
Fukushima University, Japan
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5.
Hybrid Curable OCA for New Assembly Line of Touch Screen Panel
Hyun-Joong Kim
Savannah, United States of America
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4.
Synthesis and Evaluation of Hybrid Curing OCA Using UV Polymerization
Hyun-Joong Kim Tae-Hyung Lee Sung-Ju Lee Ji-Won Park
Savannah, United States of America
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3.
Evaluation of UV-Curing Kinetics of the UV Polymerized Adhesives with Poly(ethylene glycol) Dimethacrylate
Ji-Won Park Hoon Kim Hyun-Joong Kim
Savannah, United States of America
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2.
Understanding and Evaluation on the Linear Shrinkage of Photo-Curing Behavior through the Experimental Approach and Numerical Modeling
Ji-Won Park Jong-Gyu Lee Hyun-Joong Kim
Savannah, United States of America
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1.
The Role of the Adhesive to Overcome the Bottleneck in the Electrical and Electronic Convergence Industry [Invited Speaker]
Hyun-Joong Kim
Shanghai, China