접착과학 및 바이오복합재료 연구실

Total Results : 3

• 3. PosterPolymer Syntheis and Properties of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
  Seung-Woo Lee Tae-Hyung-Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim Seung-Man Kim Jae-Hak Lee Jun-Yeob Song
  Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference (October 22, 2014 ~ October 24, 2014 / Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference)
  University of Tokyo, Japan
• 2. PosterPolymer Testing of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
  Seung-Woo Lee Tae-Hyung Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim Sung-Hun Lee Seung-Man Kim Jae-Hak Lee
  Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference (October 22, 2014 ~ October 24, 2014 / Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference)
  University of Tokyo, Japan
• 1. PosterDesign and Characterizations of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
  Seung-Woo Lee Tae-Hyung Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim Sung-Hun Lee Seung-Man Kim Jae-Hak Lee
  Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference (October 22, 2014 ~ October 24, 2014 / Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference)
  University of Tokyo, Japan