접착과학 및 바이오복합재료 연구실

Total Results : 4

• 4. OralTemporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
  Seung-Woo Lee Cho-Hee Park Ji-Won Park Hyun-Joong Kim Dong-Hyuk Lim Jun-Yeob Song Jae-Hak Lee Hyoung-Jun Kim
  2nd International Workshop on Advanced Packaging & System Technology (September 03, 2013 ~ September 05, 2013 / 2nd International Workshop on Advanced Packaging & System Technology)
  Kitami Institute of Technology, Japan
• 3. OralImprovement of Thermal Stability of Photo-cured Pressure Sensitive Adhesive by Multi-functional Crosslinker and Filler
  Hyung-Il Kim Myeongrang Kang Chong-Min Ryu Jin-Xin Hyun-Joong Kim
  2nd International Workshop on Advanced Packaging & System Technology (September 03, 2013 ~ September 05, 2013 / 2nd International Workshop on Advanced Packaging & System Technology)
  Kitami Institute of Technology, Japan
• 2. PosterAdhesive Modification for Temporary Wafer Bonding
  Cho-Hee Park Seung-Woo Lee Ji-Won Park Hyun-Joong Kim Dong-Hyuk Lim Jun-Yeob Song Jae-Hak Lee
  2nd International Workshop on Advanced Packaging & System Technology (September 03, 2013 ~ September 05, 2013 / 2nd International Workshop on Advanced Packaging & System Technology)
  Kitami Institute of Technology, Japan
• 1. PosterUV-curing Behavior and Thermal Property of Temporary Adhesives in MCP Process
  Seung-Woo Lee Cho-Hee Park Ji-Won Park Hyun-Joong Kim Dong-Hyuk Lim Jun-Yeob Song Jae-Hak Lee Hyoung-Jun Kim
  2nd International Workshop on Advanced Packaging & System Technology (September 03, 2013 ~ September 05, 2013 / 2nd International Workshop on Advanced Packaging & System Technology)
  Kitami Institute of Technology, Japan