접착과학 및 바이오복합재료 연구실

Total Results : 2

• 2. Synthesis and UV-Curing Behaviors of Urethane Acrylic Oligomers Modified by the Incorporation of Silicone Diols into the Soft Segments for a 3D Multi-Chip Package ProcessLee2015_Article_SynthesisAndUV-CuringBehaviors.pdf
  Seung-Woo Lee, Tae-Hyung Lee Ji-Won Park Hyun-Joong Kim
  Journal of Electronic Materials, 44 (7), pp. 2406-2413 (2015)
• 1. Curing Behaviors of UV-Curable Temporary Adhesives for a 3D Multichip Package ProcessCuring Behaviors of UV-Curable Temporary Adhesives for a 3D Multichip Package Process.pdf
  Seung-Woo Lee, Tae-Hyung Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim Jun-Yeob Song, Jae-Hak Lee
  Journal of Electronic Materials, 43 (11), pp. 4246-4254 (2014)