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한국정밀공학회지
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1.
Temporary Bonding and Debonding 공정용 UV 경화형 접착 소재의 코팅 두께에 따른 물성 및 경화거동
Temporary_Bonding_and_Debonding_공정용_UV_경화형_접착_소재의_코팅_두께에_따른_물성_및_경화거동.pdf
이승우, 이태형, 박지원, 박초희, 김현중
한국정밀공학회지
, 31 (10), pp. 873-879 (
2014
)
1