접착과학 및 바이오복합재료 연구실

Total Results : 2

• 2. OralUV-curing Behaviors and Thermal Stability of Dual curable Urethane Epoxy Adhesives for Temporary Bonding in 3D Multi-Chip Package Process
  Seung-Woo Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim Dong-Hyuk Lim Jun-Yeob Song Jae-Hak Lee Chang-Woo Lee
  2012 THe Korean Society for Precision Engineering (October 25, 2012 ~ October 27, 2012 / THe Korean Society for Precision Engineering)
  Gwanju, South Korea
• 1. Poster멀티 칩 패키징 공정에서의 박형 웨이퍼 핸들링을 위한 임시 고정형 접착제 연구
  Cho-Hee Park Ji-Won Park Seung-Woo Lee Hyun-Joong Kim Dong-Hyuk Lim Chang-Woo Lee Jae-Hak Lee Jun-Yeob Song
  2012 THe Korean Society for Precision Engineering (October 25, 2012 ~ October 27, 2012 / THe Korean Society for Precision Engineering)
  Gwanju, South Korea