접착과학 및 바이오복합재료 연구실
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Smart CARD
Research
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Research Collaboration
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Member
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Alumni
Old Alumni
Publication
SCI(E) Papers
Domesic Papers
Thesis (Ph.D)
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International Conference
Domestic Conference
Reviews
Books
Patents (Application/출원)
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MCP 반도체용 Bonding 및 Debonding 점착소재의 개발 및 물성제어
기간
2008년 12월 01일 ~ 2010년 02월 28일
지원기관
산업기술연구회 협동연구사업 (지식경제부)
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