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2008 Shanghai International Conference of Epoxy and Polyurethane Bonding Technology
일시
May 30, 2008 ~ May 31, 2008
참가자
박영준
장소
Shanghai, P.R, China
상세내용
2008 Shanghai International Conference of Epoxy and Polyurethane Bonding Technology에 참여하여 아래와 같이 발표하였음.
박영준 박사 - (Oral)
Curing Behaviors of Dual-curable Adhesives using Epoxy Resin
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