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Publication
SCI(E) Papers
Domesic Papers
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Thesis (MS)
International Conference
Domestic Conference
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Patents (Registration/등록)
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제 3회 한일기능성고분자학술교류회
일시
March 17, 2015 ~ March 19, 2015
참가자
김현중 교수님
장소
후쿠시마 대학, 일본
상세내용
제 3회 한일기능성고분자학술교류회에 참여하여 아래와 같이 발표하였음.
김현중 교수 - (Invited Speaker)
Temporary Bonding and UV Laser Debondable Adhesives for 3D Multi-chip Packaging Process
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