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5th World Congress on Adhesion and Related Phenomena
일시
September 07, 2014 ~ September 11, 2014
참가자
김현중 교수님, 박지원, 이승우, 박초희, 이태형, 김훈, 이종규, 이성주, 심규성
장소
Nara Prefectural New Public Hall, Japan
상세내용
5th World Congress on Adhesion and Related Phenomena에 참여하여 아래와 같이 발표하였음.
김현중 교수 - (Invited Speaker)
The Role of the Adhesive to overcome the bottleneck in the electrical and electronic convergence Industry
(Oral) Preparation of Cloud Point Resistant-adhesive and its Performance for Touch Screen Panel
Peng Dou Post.Doc - (Oral)
Study on Adhesion properties of Hot-melt pressure Adhesive based on epoxidized Styrene-isoprene-styrene(ESIS) Copolymer for Transdermal Drug Delivery Systems(TDDS)
박지원 박사수료 - (Oral)
Evaluation of Shrinkage at UV Curing Process by Comparing Between Numerical Approach and Experimental Methods
Fabrication of Hybrid Optically Clear Adhesives with UV Cationic Curing for Improving Properties and Black Matrix Curing
이승우 박사수료 - (Oral)
Design and Characterization of Temporary Bonding and Debonding Adhesives for 3D Multichip Packaging Process
김훈 석박통합과정 - (Oral)
Synthesis and adhesion performance of acrylic polymer/organoclay nanocomposite PSAs by in-situ photoinitiated polymerization
이태형 석박통합과정 - (Oral)
Analysis of the Curing Behavior and Adhesion Properties of Thermal/UV Dual-curing System for Optically Clear Adhesives
이종규 석사과정 - (Oral)
Research on Conductivity Change of Electrical Conductive Adhesives depends on Shrinkage
이성주 석박통합과정 - (Oral)
Thermal Properties of Acrylic Pressure Sensitive Adhesives with Micro-encapsulated Phase Change Material(PCM) and Single Wall Carbon Nanotubes(SWCNT)
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