International Bonding Technology Symposium 2013, 5th Asian Conference on Adhesion

International Bonding Technology Symposium 2013, 5th Asian Conference on Adhesion
일시 September 15, 2013 ~ September 17, 2013
참가자 김현중 교수님, 박지원, 이승우, 박초희
장소 Beijing Friendship Hotel, China
상세내용 International Bonding Technology Symposium 2013, 5th Asian Conference on Adhesion에 참여하여 아래와 같이 발표하였음.

박지원 박사수료 - (Oral)
Evaluation of UV Curing Behavior of UV Curable Resin through a Variety of Devices

이승우 박사수료 - (Oral)
Adhesion Performance and Curing Behaviors of Dual Curable Urethane Acrylic Adhesives for Temporary Bonding in 3D Multi-chip Package Process

박초희 박사수료 - (Oral)
Curing Behavior and Thermal Property of Adhesive Based on Epoxy and Acrylic Functionalities

접착과학 및 바이오복합재료 연구실